一、个人基本信息
出生日期： 1988年 6月
籍贯： 山东省泰安市
性 别： 女
民 族： 回族
职称： 讲师
最高学历： 博士研究生
工作单位：taptap下载安装安卓电子信息与自动化学院
通信地址：天津市taptap下载安装安卓南院海航科技大厦E406
邮政编码：300300
电子邮箱：ppzuo@cauc.edu.cn
二、学习和工作经历简介
2006.09-2010.07: 内蒙古大学，学士，通信工程
2014.09-2020.07: 河北工业大学，博士，电子科学与技术
2018.06-2019.09: 浙江大学，联合培养
2020.11 -至今  : taptap下载安装安卓，电子信息与自动化学院，讲师
三、学术兼职
担任IEEE Transactions on Electromagnetic Compatibility, IEEE ACCESS，IEEE Transactions on Components Packaging and Manufacturing Technology等期刊审稿人；
担任第十三届亚太电磁兼容国际学术会议（Asia-Pacific Electromagnetic Compatibility 2022）会议的组委会成员及分会场主席。
四、社会兼职
无
五、荣誉称号
无
六、主要研究方向和科研业绩
研究方向：
三维集成系统级封装
人工电磁超材料
毫米波天线
科研业绩：
国家自然科学基金项目，61371031：三维集成电路的电磁问题分析和关键技术研究，参与；
国家自然科学基金项目，61571395：先进三维集成系统级封装的电热问题与高速信号传输特性研究，参与；
天津市教委科研计划项目-自然科学项目，KJZ46420230049：综合模块化航空电子设备LRM模块辐射电磁干扰源的数理表征方法及空间耦合感知预测，参与；
河北省高等学校高层次人才科学研究项目，GCC2014011：高速集成电路电磁兼容研究，参与；
中央高校基本科研业务项目，210522002033：基于超材料的小型化宽阻带电磁带隙研究，主持；
横向项目，H01420230107，集成电路近场辐射敏感性测试平台开发，参与。
获奖：
获第60届电气和电子工程师学会国际电磁兼容学术大会暨第九届亚太地区电磁兼容国际学术大会联合会议(2018 Joint IEEE EMC & APEMC, Singapore) “IEEE 电磁兼容最佳学生论文”奖。
七、论著目录
学术论文：
[1] P. Zuo, T. Li, E.-P. Li, et al., "Miniaturized Polarization Insensitive Metamaterial Absorber Applied on EMI Suppression," in IEEE Access, vol. 8, pp. 6583-6590, 2020. (SCI, JCR-Q1，中科院二区)
[2] T. Li, Da Li, P. Zuo, et al., "A Novel Miniaturized Strong-Coupled FSS Structure with Excellent Angular Stability," in IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 1, pp. 38-45, Feb. 2021. (SCI, JCR-Q1，中科院二区)
[3] P. Zuo, Y. Li, Y. Xu, H. Zheng and E. Li, "Near-Field Radiation Estimation and Its Reduction Using a Novel EBG for PCB," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 2, pp. 329-335, Feb. 2019. (SCI,JCR-Q3，中科院三区)
[4] P. Zuo, Y. Li, E.-P. Li, et al., "A novel electromagnetic bandgap design applied for suppression of printed circuit board electromagnetic radiation," in International Journal of RF and Microwave Computer-Aided Engineering, vol. 30, no. 1, p. e21990, 2020. (SCI, JCR-Q3，中科院四区)
[5] T. Song, P. Zuo, Y. Li, et al., “Investigation of Multilayer Print Circuit Board Probe with Temperature Compensation for Ultra-Wideband Near-Field Measurement,” in IEEE Transactions on Electromagnetic Compatibility, 2019. (SCI, JCR-Q2，中科院二区)
[6] P. Zuo, T. Li, M. Wang, H. Zheng, and E. Li, " A Novel Frequency Selective Surface Applied for EMI Suppression in Integrated Circuit Package," 12th International Workshop on the EMC of IC, Hangzhou, China, 2019, pp. 269-271. (EI)
[7] 左盼盼,王蒙军,郑宏兴,李尔平.一种具有超宽禁带的 S-CSRR 新型电磁带隙结构[J]. 微波学报, 2019 Vol. 35(3): 37-40. (中文核心, CSCD)
[8] 左盼盼,宋涛,王蒙军, 郑宏兴,李尔平.先进电子器件封装中键合引线的电磁特性[J].半导体技术，2019 Vol. 44(369): 390-394. (中文核心, CSCD)
[9] P. Zuo, Y. Li, Y. Xu, H. Zheng and E. Li, "Quantification of EMI for power-ground plane and novel EBG structure for SSN suppression," 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Singapore, 2018, pp. 546-549. （EI）
[10] P. Zuo, W. Cao, Y. Li, Y. Xu, H. Zheng and E. Li, "Radiation emission for parallel planes with vias in packaging," 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Haining, 2017, pp. 1-4.（EI）
[11] P. Zuo, M. Wang, H. Li, T. Song and J. Liu, "Transmission performance of bonding wire at high frequency," 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, 2016, pp. 940-942.（EI）
[12] P. Zuo, M. Wang, H. Li, T. Song, J. Liu and E. Li, "Modeling and analysis of transmission performance of bonding wire interconnection," 2016 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Beijing, 2016, pp. 1-2.（EI）